The PACE TF1800 is a BGA (Ball Grid Array) and SMD (Surface Mount Device) rework system designed for efficient and precise reflow soldering. Here are some key details:

• Heating Technology: It uses Inductive-Convection Heating Technology, which allows the top-side heater to reach the target temperature in just seconds.

• Applications: Suitable for both component installation and removal.

• Efficiency: Highly efficient design, requiring much less power compared to conventional heating technologies.

• Thermal Mass: Capable of handling high thermal mass PCBs (Printed Circuit Boards)

Detailed Specifications:

• Heating Technology: Inductive-Convection Heating Technology

• Top Heater: 300 Watt Inductive-Convection Heater with a temperature range of 100°C to 328°C (212°F to 624°F)

• Max Airflow: 30 SLPM (Standard Liters Per Minute)

• Vacuum: Approx. 25 in/Hg at vacuum pick; 4 in/Hg at accessory port

• Optics: 1080p color camera with a dichroic image splitting prism

• Positioning Accuracy: High precision Z travel

• Vacuum Picks: Comes with seven (7) vacuum picks for various SMD sizes

• O-rings: Includes 8 O-rings for irregularly surfaced components

• Optional Micro Vacuum Pick: 20 gauge available

• Applications: Suitable for both component installation and removal

• Efficiency: Highly efficient design, requiring much less power compared to conventional heating technologies

• Thermal Mass: Capable of handling high thermal mass PCBs