The 2014 Heller 1707 MK3 is a high-performance SMT reflow oven designed for medium to high-volume PCB production. Here’s a detailed breakdown of its capabilities:

🔥 Heller 1707 MK3 Reflow Oven (2014)

• Heating Zones: 7 zones (top and bottom), forced convection
• Cooling Zones: 1 zone
• Max PCB Width: 18″ standard, 22″ optional (approx. 46–56 cm)
• Board Width Range: 2″–18″ (5–46 cm)
• Temperature Range: 60–350°C
• Temperature Accuracy: ±0.1°C; cross-belt tolerance ±2.0°C
• Heater Type: Instant-response open coil, 6000W per zone
• Conveyor System: Edge rail with mesh belt, auto width adjustment
• Process Speed: Up to 24 inches/min (60 cm/min)
• Profiling: Advanced 5-thermocouple profiling with storage for 500 recipes and graphs
• Power Requirements: 208/240V, 3-phase, 100A breaker; other voltages optional
• Dimensions: 134″ L × 56″ W × 63″ H (approx. 340 × 142 × 160 cm)
• Weight: ~3550 lbs (1610 kg); shipping weight ~4400 lbs (1990 kg)

Process Highlights

• Rapid thermal response (<1 sec) for tight profile control
• Suitable for lead-free soldering
• Compatible with air or nitrogen environments
• Designed for high mix, medium volume throughput
• Compact footprint for efficient floor space usage

This model is prized for its profile consistency, energy efficiency, and ease of integration into automated SMT lines.

Fully Functional