The Glenbrook JewelBox 90T is a high-resolution, real-time X-ray inspection system designed for precision imaging in electronics manufacturing and failure analysis.

Key Features
– Micro-focus X-ray tube: 90kV with a 5-micron focal spot for deep penetration and fine detail.
– Magnification: Variable from 7X to 2000X, enabling inspection of both large assemblies and minute components.
– Resolution: 100 line pairs/mm, ideal for detecting solder voids, wire sweeps, and micro-cracks.
– Five-axis joystick positioner: Allows full 360° rotation and tilt for comprehensive viewing angles.
– GTI-5000 Image Processing Workstation: Includes Auto-BGA analysis, void measurement, and advanced imaging tools.

Inspection Capabilities
– Suitable for BGAs, micro-BGAs, flip chips, ICs, and other advanced packages.
– Can image low-density materials like plastics and polymers, as well as dense components like ceramics and titanium.
– Offers programmable motion control and dual-camera capabilities for enhanced automation and flexibility

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